Asus P6T WS Professional - Handbuch (Seite 41)

ASUS P6T WS Professional 2-15
P6T WS Professional Motherboard Liste qualifizierter Anbieter
(QVL) für DDR3-1333MHz (Forts.)
Anbieter Teilnr. Größe SS/DS Chipnr. CL Chip-Marke
DIMM-Steckplatz-
u n t e r s t ü t z u n g
(optional)
A* B* C* D*
G.SKILL F3-10666CL9D-4GBPK
4GB
(Kit of 2)
DS Heat-Sink Package 9-9-9-24 N/A • • • •
KINGMAX FLFD45F-B8EE9 1GB SS J1108BASE-DJ-E N/A ELPIDA • • • •
Kingston KVR1333D3N9/1G 1GB SS J1108BASE-DJ-E N/A ELPIDA • • • •
Kingston KVR1333D3N9/2G 2GB DS J1108BASE-DJ-E N/A ELPIDA • • • •
MICRON MT8JTF12864AY-1G4BYES 1GB SS Z9HWR 9 MICRON •
MICRON MT16JTF25664AY-1G4BYES 2GB DS Z9HWR 9 MICRON • • • •
OCZ OCZ3RPX1333EB2GK 1GB SS Heat-Sink Package 6-5-5 N/A • •
OCZ OCZ3P13332GK 1GB DS Heat-Sink Package 7-7-7-20 N/A •
OCZ OCZ3P13334GK
4GB
(Kit of 2)
DS Heat-Sink Package 7 N/A • • •
OCZ OCZ3RPX1333EB4GK
4GB
(Kit of 2)
DS Heat-Sink Package 6 5 5 N/A • •
Qimonda IMSH1GU03A1F1C-13H 1GB SS IDSH1G-03A1F1C-13H N/A N/A • • • •
Qimonda IMSH2GU13A1F1C-13H 2GB DS IDSH1G-03A1F1C-13H N/A N/A • • • •
SAMSUNG M378B2873DZ1-CH9 1GB SS K4B1G0846D 9 SAMSUNG • • • •
SAMSUNG M391B2873DZ1-CH9 1GB SS K4B1G0846D(ECC) 9 SAMSUNG • • • •
SAMSUNG M378B5673DZ1-CH9 2GB DS K4B1G0846D 9 SAMSUNG • • • •
SAMSUNG M391B5673DZ1-CH9 2GB DS K4B1G0846D(ECC) 9 SAMSUNG • • • •
Transcend TS128MLK64V3U 1GB SS K4B1G0846D 9 SAMSUNG • • •
Transcend TS256MLK64V3U 2GB DS K4B1G0846D 9 SAMSUNG • • •
Aeneon AEH760UD00-13H 1GB DS AEH93R13H 9 AENEON • • • •
BUFFALO FSX1333D3G-1G 1GB SS Heat-Sink Package 7-7-7-20 N/A • • • •
BUFFALO FSX1333D3G-2G 2GB DS Heat-Sink Package 7-7-7-20 N/A • • • •
Elixir M2F2G64CB8HA4N-CG 2GB DS N2CB1G80AN-CG 9 Elixir • • • •
Patriot PDC32G1333LLK
1GB
(Kit of 2)
SS Heat-Sink Package 7 Patriot • • • •
Kingston KHX11000D3ULK2/2G
DDR3 1375
2GB
(Kit of 2)
DS Heat-Sink Package N/A N/A • • •