BECKHOFF CB4060 Benutzerhandbuch
Seite 4
Inhalt
Seite 4
Beckhoff New Automation Technology CB4060
5.3.4
CPU Configuration .............................................................................................................. 49
5.3.5
SATA Configuration ............................................................................................................ 52
5.3.6
AMT Configuration .............................................................................................................. 55
5.3.7
Power Controller Options ................................................................................................... 57
5.3.8
USB Configuration .............................................................................................................. 59
5.3.9
Super IO Configuration ....................................................................................................... 60
5.3.10
H/W Monitor ........................................................................................................................ 62
5.3.11
Serial Port Console Redirection ......................................................................................... 64
5.3.12
Network Stack ..................................................................................................................... 67
5.3.13
Intel(R) Ethernet Connection I218-LM ................................................................................ 68
5.3.14
Intel(R) I210 Gigabit Network Connection .......................................................................... 70
5.3.15
Driver Health ....................................................................................................................... 72
5.4
Chipset ........................................................................................................................................ 74
5.4.1
PCH-IO Configuration ......................................................................................................... 75
5.4.2
System Agent (SA) Configuration ....................................................................................... 82
5.5
Boot ............................................................................................................................................ 92
5.5.1
CSM16 Parameters ............................................................................................................ 94
5.5.2
CSM Parameters ................................................................................................................ 95
5.6
Security ....................................................................................................................................... 96
5.6.1
Secure Boot Menu .............................................................................................................. 97
5.7
Save & Exit ............................................................................................................................... 100
5.8
BIOS-Update ............................................................................................................................ 101
6
Mechanische Zeichnung .................................................................................................................. 102
6.1
Leiterplatte: Bohrungen ............................................................................................................ 102
6.2
Leiterplatte: Pin-1-Abstände Top .............................................................................................. 103
6.3
Leiterplatte: Pin-1-Abstände Bottom ........................................................................................ 104
6.4
Leiterplatte: Kühlkörper/Die Center .......................................................................................... 105
7
Technische Daten ............................................................................................................................ 106
7.1
Elektrische Daten ..................................................................................................................... 106
7.2
Umgebungsbedingungen ......................................................................................................... 106
7.3
Thermische Spezifikationen ..................................................................................................... 107
8
Support und Service ........................................................................................................................ 108
8.1
Beckhoff-Support ...................................................................................................................... 108
8.2
Beckhoff-Service ...................................................................................................................... 108
8.3
Beckhoff-Firmenzentrale .......................................................................................................... 108
I
Anhang: Post-Codes ........................................................................................................................ 110
II
Anhang: Ressourcen ....................................................................................................................... 112
IO-Bereich ............................................................................................................................................ 112
Memory-Bereich ................................................................................................................................... 112
Interrupt ................................................................................................................................................ 112
PCI-Devices ......................................................................................................................................... 113
Ressourcen: SMB-Devices .................................................................................................................. 114